Multiple-gate semiconductor device and method

ABSTRACT

A system and method for manufacturing multiple-gate semiconductor devices is disclosed. An embodiment comprises multiple fins, wherein intra-fin isolation regions extend into the substrate less than inter-fin isolation regions. Regions of the multiple fins not covered by the gate stack are removed and source/drain regions are formed from the substrate so as to avoid the formation of voids between the fins in the source/drain region.

This application claims the benefit of U.S. patent application Ser. No.12/797,382, entitled “Multiple-Gate Semiconductor Device and Method,”filed on Jun. 9, 2010, which claims the benefit of U.S. ProvisionalPatent Application Ser. No. 61/266,009,filed on Dec. 2, 2009, andentitled “Multiple-Gate Semiconductor Device and Method,” whichapplications are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to semiconductor devices and,more particularly, to FinFET semiconductor devices.

BACKGROUND

In the race to improve transistor performance as well as reduce the sizeof transistors, transistors have been developed that do not follow thetraditional planar format, such that the channel and source/drainregions are located in a fin formed from the bulk substrate. One suchnon-planar device is a multiple-gate FinFET. In its simplest form, amultiple-gate FinFET has a gate electrode that straddles across afin-like silicon body to form a channel region. In this configuration,there are at least two gates, one on each sidewall of the silicon fin.

In an effort to improve the performance of the multiple-gate FinFET,stress may be generated in the channel region of the substrate betweenthe source/drain regions by removing the fins and then regrowing thefins with a different material. However, in FinFET devices wheremultiple channels may share a common gate electrode, the closeness ofthe fins during regrowth causes voids to form in between the re-grownsource/drain regions as there is not enough space between the regrownsource/drain regions to allow subsequently formed layers (such as acontact etch stop layer) to fill the small regions between the re-grownsource/drain regions. These voids where there is no re-grownsource/drain to cause stress may decrease the overall potentialperformance of the device.

As such, what is needed is a structure (and method to form thestructure) that allows for a larger stress level and for better controlof the stress that may be applied to the channel regions of a FinFETdevice.

SUMMARY OF THE INVENTION

These and other problems are generally solved or circumvented, andtechnical advantages are generally achieved, by embodiments of thepresent invention which are directed towards a FinFET structure with acommon source/drain region along with inter-fin and intra-fin isolationregions with differing heights.

In accordance with an embodiment of the present invention, asemiconductor device comprises a substrate comprising a first fin and asecond fin. A first isolation region is located between the first finand the second fin. A second isolation region is located opposite thefirst fin from the first isolation region, the second isolation regionextending into the substrate further than the first isolation region. Acontinuous source/drain region extends from the first fin to the secondfin.

In accordance with another embodiment of the present invention, asemiconductor device comprises a substrate comprising a plurality offins. A first multiple-gate transistor is formed from a first one of theplurality of fins and a second multiple-gate transistor is formed from asecond one of the plurality of fins, wherein the first multiple-gatetransistor and second multiple-gate transistor share a source/drainregion. A first isolation region is located between the firstmultiple-gate transistor and the second multiple-gate transistor, thefirst isolation region extending into the substrate a first distance. Asecond isolation region is located adjacent the first multiple-gatetransistor and outside of the region between the first multiple-gatetransistor and the second multiple-gate transistor, the second isolationregion extending into the substrate a second distance greater than thefirst distance.

In accordance with yet another embodiment of the present invention, amethod of forming a semiconductor device comprises providing a substrateand forming a plurality of fins in the substrate. First isolationregions are formed in the substrate, the first isolation regionsextending a first depth from a surface of the substrate. Secondisolation regions are formed in the substrate, the second isolationregions extending a second depth from the surface of the substrate, thesecond depth being less than the first depth. A gate dielectric, gateelectrode, and spacers are formed over a first portion of each of thesemiconductor fins and the second isolation regions while leaving asecond portion of each of the semiconductor fins and the secondisolation regions exposed. The second portion of each of thesemiconductor fins and the second isolation regions are removed, and asource/drain region is formed, the source/drain region connecting theplurality of semiconductor fins.

In accordance with another embodiment, a method of forming asemiconductor device comprising providing a substrate and forming aplurality of fins in the substrate is provided. First isolation regionsare formed in the substrate, the first isolation regions extending afirst depth from a surface of the substrate and second isolation regionsare formed in the substrate, the second isolation regions extending asecond depth from the surface of the substrate, the second depth beingless than the first depth. A gate dielectric, gate electrode, andspacers are formed over a first portion of each of the semiconductorfins and the second isolation regions while leaving a second portion ofeach of the semiconductor fins and the second isolation regions exposed.The second portion of each of the semiconductor fins and the secondisolation regions is removed, and a source/drain region is formed, thesource/drain region connecting the plurality of semiconductor fins andextending below a top surface of the second isolation regions.

In accordance with another embodiment, a method of forming asemiconductor device comprising forming a first isolation region in asubstrate between a first fin and a second fin and forming a secondisolation region in the substrate on an opposite side of the first finfrom the first isolation region, wherein the second isolation regionextends further into the substrate than the first isolation region, isprovided. A gate stack is formed over the first fin and the second finand an exposed first portion of the first fin and an exposed secondportion of the second fin are removed, wherein the removing the exposedfirst portion of the first fin continues until the first portion of thefirst fin is below a top surface of the first isolation region. Acontinuous source/drain region is grown extending from the first fin tothe second fin.

In accordance with another embodiment, a method of forming asemiconductor device comprising depositing dielectric material into afirst opening and a second opening, wherein the first opening is locatedbetween a first fin and a second fin and wherein the second opening isnot located between the first fin and the second fin, the first openingextending into the substrate less than the second opening is provided.The dielectric material is recessed such that sidewalls of the first finand the second fin are exposed and a gate stack is formed over the firstfin and the second fin. The dielectric material is removed from a firstregion in the first opening exposed by the gate stack, and asource/drain region is grown within the first region, the source/drainregion extending between the first fin and the second fin.

An advantage of an embodiment of the present invention is that voidsbetween the fins may be avoided, thereby increasing the stress that maybe applied to the channel of the multiple-gate transistors.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIGS. 1A-3B illustrate various perspective and cross-sectional views ofthe formation of first isolation regions and second isolation regions ina substrate in accordance with an embodiment;

FIGS. 4A-4C illustrate the formation of gate dielectrics, gateelectrodes, and spacers in accordance with an embodiment;

FIGS. 5A-5C illustrate the removal of a portion of the fins inaccordance with an embodiment;

FIGS. 6A-6C illustrate the formation of a single source/drain regionconnecting the fins in accordance with an embodiment; and

FIGS. 7A-7C illustrate the formation of a contact etch stop layer inaccordance with an embodiment.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the embodiments andare not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the present embodiments are discussed in detailbelow. It should be appreciated, however, that the present embodimentsprovide many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare merely illustrative of specific ways to make and use theembodiments, and do not limit the scope of the invention.

The present invention will be described with respect to embodiments in aspecific context, namely a FinFET transistor. The invention may also beapplied, however, to other semiconductor devices, particularlynon-planar devices. For example, embodiments of the present inventionmay be utilized with non-planar resistors, diodes, and the like.

With reference now to FIGS. 1A and 1B, which show a perspective view anda cross-sectional view, respectively, there is shown a substrate 101with first trenches 102 formed therein. The substrate 101 may be asilicon substrate, although other substrates, such assemiconductor-on-insulator (SOI), strained SOI, and silicon germanium oninsulator, could alternatively be used. The substrate 101 may be ap-type semiconductor, although in other embodiments, it couldalternatively be an n-type semiconductor.

The first trenches 102 may be formed as an initial step in the eventualformation of shallow trench isolation regions (described below withrespect to FIGS. 3A-3B). The first trenches 102 may be formed using amasking layer (not shown) along with a suitable etching process. Forexample, the masking layer may be a hardmask comprising silicon nitrideformed through a process such as chemical vapor deposition (CVD),although other materials, such as oxides, oxynitrides, silicon carbide,combinations of these, or the like, and other processes, such as plasmaenhanced chemical vapor deposition (PECVD), low pressure chemical vapordeposition (LPCVD), or even silicon oxide formation followed bynitridation, may alternatively be utilized. Once formed, the maskinglayer may be patterned through a suitable photolithographic process toexpose those portions of the substrate 101 that will be removed to formthe first trenches 102.

As one of skill in the art will recognize, however, the processes andmaterials described above to form the masking layer are not the onlymethod that may be used to protect portions of the substrate 101 whileexposing other portions of the substrate 101 for the formation of thefirst trenches 102. Any suitable process, such as a patterned anddeveloped photoresist, may alternatively be utilized to expose portionsof the substrate 101 to be removed to form the trenches 102. All suchmethods are fully intended to be included in the scope of the presentinvention.

Once a masking layer has been formed and patterned, the first trenches102 are formed in the substrate 101. The exposed substrate 101 may beremoved through a suitable process such as reactive ion etching (RIE) inorder to form the first trenches 102 in the substrate 101, althoughother suitable processes may alternatively be used. In an embodiment,the first trenches 102 may be formed to have a first depth d₁ be lessthan about 5,000 Å from the surface of the substrate 101, such as about2,500 Å. As explained below with respect to FIGS. 2A-2B, the area of thesubstrate 101 between the first trenches 102 is subsequently patternedto form individual fins of the FinFET.

FIGS. 2A-2B illustrate the formation of fins 203 along with secondtrenches 201. For the sake of clarity, FIGS. 2A-2B have been enlargedfrom FIGS. 1A-1B to show the interior of the first trenches 102. Thesecond trenches 201 are located between the first trenches 102, and areintended to be intra-Fin isolation regions, such as isolation regionsbetween separate fins 203 that share either a similar gate or similarsources or drains. As such, while the second trenches 201 may beintra-Fin isolation regions, the first trenches 102 may be inter-Finisolation regions located between fins that do not share a similar gate,source, or drain.

The second trenches 201 may be formed using a similar process as thefirst trenches 102 (discussed above with respect to FIG. 1) such as asuitable masking or photolithography process followed by an etchingprocess. Additionally, the formation of the second trenches 201 may alsobe used to deepen the first trenches 102, such that the first trenches102 extend into the substrate 101 a further distance than the secondtrenches 201. This may be done by using a suitable mask to expose boththe first trenches 102 as well as those areas of the substrate 101 thatwill be removed to form the second trenches 201. As such, the firsttrenches 102 may have a final second depth d₂ of between about 200 Å andabout 7,000 Å, such as about 3,190 Å, and the second trenches 201 may beformed to have a third depth d₃ of between about 100 Å and about 1,500Å, such as about 1,000 Å.

However, as one of ordinary skill in the art will recognize, the processdescribed above to form inter-fin first trenches 102 and intra-finsecond trenches 201 is merely one potential process, and is not meant tobe the only embodiment. Rather, any suitable process through which firsttrenches 102 and second trenches 201 may be formed such that theinter-fin first trenches 102 extend into the substrate 101 further thanthe intra-fin second trenches 201 may be utilized. For example, thefirst trenches 102 may be formed in a single etch step and thenprotected during the formation of the second trenches 201. Any suitableprocess, including any number of masking and removal steps mayalternatively be used.

In addition to forming the second trenches 201, the masking and etchingprocess additionally forms fins 203 from those portions of the substrate101 that remain unremoved. These fins 203 may be used, as discussedbelow, to form the channel region of multiple-gate FinFET transistors.While FIG. 2 only illustrates three fins 203 formed from the substrate101, any number of fins 203 that are greater than one may be utilizedsuch that there are intra-fin second trenches 201 and inter-fin firsttrenches 102.

The fins 203 may be formed such that they have a first width w₁ at thesurface of the substrate 101 of between about 5 nm and about 80 nm, suchas about 30 nm. Additionally, the fins 203 may be formed such that theyhave a pitch P₁ of between about 30 nm and about 150 nm, such as about90 nm. By spacing the fins 203 in such a fashion, the fins 203 may eachform a separate channel region while still being close enough to share acommon gate (whose formation is discussed below in relation to FIG. 4).

FIGS. 3A-3B illustrate the filling of the first trenches 102 and secondtrenches 201 with a dielectric material 301 and the recessing of thedielectric material 301 within the first trenches 102 and secondtrenches 201 to form first isolation regions 307 and second isolationregions 309, respectively. In this embodiment, each of the secondisolation regions 309 extends into the substrate less than firstisolation regions 307. The dielectric material 301 may be an oxidematerial, a high-density plasma (HDP) oxide, or the like. The dielectricmaterial 301 may be formed, after an optional cleaning and lining of thefirst trenches 102 and second trenches 201, using either a chemicalvapor deposition (CVD) method (e.g., the HARP process), a high densityplasma CVD method, or other suitable method of formation as is known inthe art.

The first trenches 102 and second trenches 201 may be filled byoverfilling the first trenches 102 and second trenches 201 and thesubstrate 101 with the dielectric material 301 and then removing theexcess material outside of the first trenches 102 and second trenches201 and substrate 101 through a suitable process such as chemicalmechanical polishing (CMP), an etch, a combination of these, or thelike. In an embodiment, the removal process removes any dielectricmaterial 301 that is located over the substrate 101 as well, so that theremoval of the dielectric material 301 will expose the surface of thesubstrate 101 to further processing steps.

Once the first trenches 102 and second trenches 201 have been filledwith the dielectric material 301, the dielectric material 301 may thenbe recessed away from the surface of the substrate 101. The recessingmay be performed to expose at least a portion of the sidewalls of thefins 203 adjacent to the top surface of the substrate 101. Thedielectric material 301 may be recessed using a wet etch by dipping thetop surface of the substrate 101 into an etchant such as HF, althoughother etchants, such as H₂, and other methods, such as a reactive ionetch, a dry etch with etchants such as NH₃/NF₃, chemical oxide removal,or dry chemical clean may alternatively be used. The dielectric material301 may be recessed to a fourth depth d₄ from the surface of thesubstrate 101 of between about 50 Å and about 500 Å, such as about 400Å. Additionally, the recessing may also remove any leftover dielectricmaterial 301 located over the substrate 101 to ensure that the substrate101 is exposed for further processing.

As one of ordinary skill in the art will recognize, however, the stepsdescribed above may be only part of the overall process flow used tofill and recess the dielectric material 301. For example, lining steps,cleaning steps, annealing steps, gap filling steps, combinations ofthese, and the like may also be utilized to form and fill the firsttrenches 102 and second trenches 201 with the dielectric material 301.All of the potential process steps are fully intended to be includedwithin the scope of the present embodiment.

FIGS. 4A-4C illustrate the formation of a gate dielectric layer 401,gate electrode 403, and first spacers 407 over each of the fins 203.While FIG. 4B maintains the cross-sectional view along line B-B′ as inFIGS. 1-3, FIG. 4C has been added as a second cross-sectional view alongthe line C-C′ in order to illustrate a separate region of the fins 203.

The gate dielectric layer 401 (not visible in FIG. 4A but seen in FIG.4B) may be formed by thermal oxidation, chemical vapor deposition,sputtering, or any other methods known and used in the art for forming agate dielectric. Depending on the technique of gate dielectricformation, the gate dielectric 401 thickness on the top of the fins 203may be different from the gate dielectric thickness on the sidewall ofthe fins 203.

The gate dielectric 401 may comprise a material such as silicon dioxideor silicon oxynitride with a thickness ranging from about 3 angstroms toabout 100 angstroms, such as about 10 angstroms. The gate dielectric 401may alternatively be formed from a high permittivity (high-k) material(e.g., with a relative permittivity greater than about 5) such aslanthanum oxide (La₂O₃), aluminum oxide (Al₂O₃), hafnium oxide (HfO₂),hafnium oxynitride (HfON), or zirconium oxide (ZrO₂), or combinationsthereof, with an equivalent oxide thickness of about 0.5 angstroms toabout 100 angstroms, such as about 10 angstroms or less. Additionally,any combination of silicon dioxide, silicon oxynitirde, and/or high-kmaterials may also be used for the gate dielectric 401.

The gate electrode 403 may comprise a conductive material and may beselected from a group comprising of polycrystalline-silicon (poly-Si),poly-crystalline silicon-germanium (poly-SiGe), metallic nitrides,metallic silicides, metallic oxides, metals, combinations of these, andthe like. Examples of metallic nitrides include tungsten nitride,molybdenum nitride, titanium nitride, and tantalum nitride, or theircombinations. Examples of metallic silicide include tungsten silicide,titanium silicide, cobalt silicide, nickel silicide, platinum silicide,erbium silicide, or their combinations. Examples of metallic oxidesinclude ruthenium oxide, indium tin oxide, or their combinations.Examples of metal include tungsten, titanium, aluminum, copper,molybdenum, nickel, platinum, etc.

The gate electrode 403 may be deposited by chemical vapor deposition(CVD), sputter deposition, or other techniques known and used in the artfor depositing conductive materials. The thickness of the gate electrode403 may be in the range of about 200 angstroms to about 4,000 angstroms.The top surface of the gate electrode 403 may have a non-planar topsurface, and may be planarized prior to patterning of the gate electrode403 or gate etch. Ions may or may not be introduced into the gateelectrode 403 at this point. Ions may be introduced, for example, by ionimplantation techniques.

Once formed, the gate dielectric 401 and the gate electrode 403 may bepatterned to form a series of gate stacks 405 over the fins 203. Thegate stacks 405 define multiple channel regions 406 (roughly illustratedby dotted circles) located in the fins 203 underneath the gatedielectric 401. The gate stacks 405 may be formed by depositing andpatterning a gate mask (not shown) on the gate electrode 403 using, forexample, deposition and photolithography techniques known in the art.The gate mask may incorporate commonly used masking materials, such as(but not limited to) photoresist material, silicon oxide, siliconoxynitride, and/or silicon nitride. The gate electrode 403 and the gatedielectric 401 may be etched using a dry etching process to form thepatterned gate stack 405.

Once gate stacks 405 are patterned, first spacers 407 may be formed. Thefirst spacers 407 may be formed on opposing sides of the gate stacks405. The first spacers 407 are typically formed by blanket depositing aspacer layer (not shown) on the previously formed structure. The spacerlayer may comprise SiN, oxynitride, SiC, SiON, oxide, and the like andmay be formed by methods utilized to form such a layer, such as chemicalvapor deposition (CVD), plasma enhanced CVD, sputter, and other methodsknown in the art. The spacer layer may comprise a different materialwith different etch characteristics than the dielectric material 301 sothat the first spacers 407 may be used as masks for the patterning ofthe dielectric material 301 (described below with references to FIGS.4A-4C). The first spacers 407 may then be patterned, such as by one ormore etches to remove the spacer layer from the horizontal surfaces ofthe structure.

FIGS. 5A-5C illustrate the removal of the fins 203 and the dielectricmaterial 301 from those areas not protected by the gate stacks 405 andfirst spacers 407. This removal may be performed by a reactive ion etch(RIE) using the gate stacks 405 and first spacers 407 as hardmasks, orby any other suitable removal process. In an embodiment, the removalremoves the fins 203 and all of the dielectric material 301 from theuncovered portions of the second trenches 201 and also reduces theheight of the dielectric material 301 in the first trenches to at leastthe third depth d₃ of the second trenches 201 away from the top of thefins 203. As such, the etch proceeds at least until the depth of theetch is greater than the third depth d₃ (see FIG. 2B) and may proceed toa depth of between about 10 nm and about 200 nm, such as about 80 nm.However, in an embodiment those portions of the fins 203 and thedielectric material 301 beneath the gate stacks 405 and first spacers407 are left behind by the additional removal.

FIGS. 6A-6C illustrate the formation of single source/drain extensions601 in contact with each of the fins 203. Once the second isolationregions 309 and fins 203 have been removed and only a surface of thesubstrate 101 is exposed, the single source/drain extensions 601 may beregrown to form a stressor that will impart a stress to the channelregions 406 of the fins 203 located underneath the gate stacks 405. Inan embodiment wherein the fins 203 comprise silicon and the FinFET is ap-type device, the single source/drain extensions 601 may be regrownthrough a selective epitaxial process with a material, such as silicongermanium that has a different lattice constant than the channel regions406. The epitaxial growth process may use precursors such as silane,dichlorosilane, germane, and the like, and may continue for betweenabout 5 minutes and about 120 minutes, such as about 30 minutes. Thesource/drain extensions 601 may be formed to have a fifth height d₅above the upper surface of the second isolation region 309 of betweenabout 5 nm and about 250 nm, such as about 100 nm.

In an embodiment the silicon germanium has a germanium content of lessthan 100% (pure Ge), such as about 36%. The lattice mismatch between thestressor material in the single source/drain extensions 601 and thechannel regions 406 will impart a stress into the channel regions 406that will increase the carrier mobility and the overall performance ofthe device.

Additionally, by removing the second isolation regions 309 and the fins203 and regrowing the single source/drain extensions 601, the voids thatcommonly form between the fins 203 are effectively removed, as theseregions have been removed and are completely filled by the grown singlesource/drain extensions 601. This allows for more stress to be appliedto the channel region 407, thereby improving the overall performance ofthe device.

FIGS. 6A-6C also illustrate the formation of optional second spacers 603over the single source/drain extensions 601 and adjacent the firstspacers 406. The second spacers 603 may be formed from similar materialsand through similar processes as the first spacers 407 (described abovewith respect to FIGS. 4A-4C).

Once the second spacers 603 are formed, dopants may be implanted intothe single source/drain extensions 601 by implanting appropriate dopantsto complement the dopants in the fins 203. For example, p-type dopantssuch as boron, gallium, indium, or the like may be implanted to form aPMOS device. Alternatively, n-type dopants such as phosphorous, arsenic,antimony, or the like may be implanted to form an NMOS device. Thesedopants may be implanted using the gate stacks 405, the first spacers407, and the second spacers 603 as masks. It should be noted that one ofordinary skill in the art will realize that many other processes, steps,or the like may be used to implant the dopants. For example, one ofordinary skill in the art will realize that a plurality of implants maybe performed using various combinations of spacers and liners to formsource/drain regions having a specific shape or characteristic suitablefor a particular purpose. Any of these processes may be used to implantthe dopants, and the above description is not meant to limit the presentinvention to the steps presented above.

After the single source/drain extensions 601 have been formed, anoptional silicide process can be used to form silicide contacts (notshown) along the single source/drain extensions 601. The silicidecontacts may comprise nickel, cobalt, platinum, or erbium in order toreduce the Schottky barrier height of the contact. However, othercommonly used metals, such as titanium, palladium, and the like, mayalso be used. As is known in the art, the silicidation may be performedby blanket deposition of an appropriate metal layer, followed by anannealing step which causes the metal to react with the underlyingexposed silicon. Un-reacted metal is then removed, such as through aselective etch process, and a second anneal may be performed for asilicide phase adjustment. The thickness of the silicide contacts may bebetween about 5 nm and about 50 nm.

FIGS. 7A-7C illustrate the formation of a contact etch stop layer (CESL)701 over the single source/drain extensions 601. The CESL 701 may beformed both to protect the underlying single source/drain extensions 601as well as to provide additional strain to the channel regions 406. TheCESL 701 may be formed of silicon nitride, although other materials,such as nitride, oxynitride, boron nitride, combinations thereof, or thelike, may alternatively be used. The CESL 701 may be formed through CVDto a thickness of between about 5 nm and about 200 nm, such as about 80nm. However, other methods of formation may alternatively be used. TheCESL 701 may be used to impart a tensile strain to the channel regions406 of the fins 203 for an NMOS device and to impart a compressivestrain to the channel regions 406 of the fins 203 for a PMOS device.

By varying the depths of the intra-fin first isolation regions 307 andthe inter-fin second isolation regions 309, removing the dielectricmaterial 301 from a portion of the fins 203 prior to growth of the fins203, filling the voids normally formed during growth, the stress appliedto the channel can be increased, thereby increasing the overallperformance of the multiple-gate transistors. For example, when threefins are utilized along with the single source/drain extension 601, thechannel stress can be increased from about 470 MPa to about 658 MPa, fora on current increase of about 6-7%.

Although the present invention and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the invention as defined by the appended claims. For example,different materials may be utilized for the source/drain stressors andthe contact etch, and different processes may be used to form thesource/drain extensions.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A method of forming a semiconductor device, themethod comprising: providing a substrate; forming a plurality of fins inthe substrate; forming first isolation regions in the substrate, thefirst isolation regions extending a first depth from a surface of thesubstrate; forming second isolation regions in the substrate, the secondisolation regions extending a second depth from the surface of thesubstrate, the second depth being less than the first depth; forming agate dielectric, gate electrode, and spacers over a first portion ofeach of the semiconductor fins and the second isolation regions whileleaving a second portion of each of the semiconductor fins and thesecond isolation regions exposed; removing the second portion of each ofthe semiconductor fins and the second isolation regions; and forming asource/drain region, the source/drain region connecting the plurality ofsemiconductor fins and extending below a top surface of the secondisolation regions.
 2. The method of claim 1, wherein the forming asource/drain region is done at least in part through an epitaxial growthprocess.
 3. The method of claim 1, further comprising forming a contactetch stop layer over the source/drain region.
 4. The method of claim 1,wherein the removing the second portion of each of the semiconductorfins and the second isolation regions further comprises recessing aportion of the first isolation regions.
 5. The method of claim 4,further comprising forming second spacers in contact with the portion ofthe first isolation regions.
 6. The method of claim 1, wherein theforming a source/drain region further comprises epitaxially growing thesource/drain region to extend over the first isolation regions.
 7. Themethod of claim 1, wherein the forming first isolation regions furthercomprises: forming first trenches; filling the first trenches with adielectric material; and recessing the dielectric material within thefirst trenches.
 8. A method of forming a semiconductor device, themethod comprising: forming a first isolation region in a substratebetween a first fin and a second fin; forming a second isolation regionin the substrate on an opposite side of the first fin from the firstisolation region, wherein the second isolation region extends furtherinto the substrate than the first isolation region; forming a gate stackover the first fin and the second fin; removing an exposed first portionof the first fin and an exposed second portion of the second fin,wherein the removing the exposed first portion of the first fincontinues until the first portion of the first fin is below a topsurface of the first isolation region; and growing a continuoussource/drain region extending from the first fin to the second fin. 9.The method of claim 8, wherein the growing the continuous source/drainregion is done at least in part through an epitaxial growth process. 10.The method of claim 8, further comprising depositing a contact etch stoplayer over the continuous source/drain region.
 11. The method of claim8, wherein the removing the exposed first portion of the first finfurther comprises recessing a portion of the second isolation region.12. The method of claim 11, further comprising forming second spacers incontact with the second isolation regions.
 13. The method of claim 8,wherein the growing a continuous source/drain region further comprisesepitaxially growing the source/drain region to extend over the secondisolation region.
 14. The method of claim 8, wherein the forming asecond isolation region further comprises: forming a first trench;filling the first trench with a dielectric material; and recessing thedielectric material within the first trench.
 15. A method of forming asemiconductor device, the method comprising: depositing dielectricmaterial into a first opening and a second opening, wherein the firstopening is located between a first fin and a second fin and wherein thesecond opening is not located between the first fin and the second fin,the first opening extending into the substrate less than the secondopening; recessing the dielectric material such that sidewalls of thefirst fin and the second fin are exposed; forming a gate stack over thefirst fin and the second fin; removing the dielectric material from afirst region in the first opening exposed by the gate stack; and growinga source/drain region within the first region, the source/drain regionextending between the first fin and the second fin.
 16. The method ofclaim 15, wherein the growing the source/drain region is done at leastin part through an epitaxial growth process.
 17. The method of claim 15,further comprising forming a contact etch stop layer over thesource/drain region.
 18. The method of claim 15, further comprisingforming spacers in contact with the dielectric material after thegrowing the source/drain region.
 19. The method of claim 15, wherein thegrowing the source/drain region further comprises epitaxially growingthe source/drain region to extend over the second opening.
 20. Themethod of claim 15, wherein the removing the dielectric material from afirst region exposed by the gate stack further removes the dielectricmaterial from a second region in the second opening exposed by the gatestack.